Inhibition of Low Pressure on Interfacial Damage in Polymer Bonded Explosive Under Temperature Fluctuation
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摘要: 该文旨在探究低压对变温环境下高聚物黏结炸药(polymer-bonded explosive,PBX)界面损伤的影响.首先基于Voronoi法生成PBX二维几何模型,并考虑炸药晶体颗粒为弹塑性、黏结剂为双层黏塑性以及采用零厚度内聚力模型反映界面黏结状况,研究了温度变化时PBX界面黏结性能的改变;再基于热力耦合处理方法,研究了低压对变温环境下PBX界面损伤的抑制作用,拟合了降温阶段界面法向应力随低压变化的曲线.结果表明,升温阶段主要是由界面切向应力导致初始损伤,降温阶段主要是界面法向应力导致界面损伤,降温比升温更容易导致界面损伤;无论升温或降温,一定的低压载荷能够抑制界面损伤,但压力过大可能导致新的损伤;为抑制界面损伤,降温过程需要的压力应高于升温过程需要的压力,这与降温阶段的界面损伤较大是一致的.Abstract: The influence of low pressure on polymer-bonded explosive (PBX) interfacial damage under temperature fluctuation was investigated. Firstly, a 2D geometric model was built with the Voronoi method. The change of interfacial bonding property was studied under temperature changes, with the particles considered as elasto-plastic, the binder as 2-layer viscoplastic and the zero-thickness cohesion model to reflect the interfacial bonding conditions. Then, the inhibition effect of low pressure on the interfacial damage of PBX under temperature fluctuation was studied based on the thermo-mechanical coupling method, and the curve of normal traction changing with low pressure was fitted. The results show that, the initial damage is mainly caused by the tangential traction of the interface in the heating stage, and the interfacial damage is mainly caused by the normal traction in the cooling stage. What’s more,the temperature drop is more likely to cause interfacial damage than the temperature rise. Regardless of temperature rise or fall, a certain low pressure can inhibit the interfacial damage, but a too high pressure may cause new damages; to inhibit the interfacial damage, the pressure required in the cooling process should be higher than that in the heating process, which is consistent with the larger interfacial damage in the cooling stage.
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Key words:
- PBX /
- Voronoi /
- temperature fluctuation /
- cohesion model /
- interfacial damage inhibition
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