PCB焊点热循环失效分析和改进设计

苏佩琳; 李涛; 彭雄奇

doi:10.3879/j.issn.1000-0887.2015.04.009

PCB焊点热循环失效分析和改进设计

doi: 10.3879/j.issn.1000-0887.2015.04.009

上海交通大学材料科学与工程学院, 上海 200030

基金项目: 国家自然科学基金(11172171)

详细信息

作者简介:
苏佩琳（1991—），女，湖北荆门人，硕士生(E-mail: su7259@163.com);彭雄奇（1970—），男，湖南娄底人，教授，博士生导师(通讯作者. E-mail: xqpeng@sjtu.edu.cn).

中图分类号: TG404;TG405
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出版历程
- 收稿日期: 2014-10-21
- 修回日期: 2015-01-07
- 刊出日期: 2015-04-15

Fatigue Failure Analysis and Structural Improvement of PCB Solder Joints Under Thermal Cycles

School of Materials Science and Engineering, Shanghai Jiao Tong University,Shanghai 200030, P.R.China

Funds: The National Natural Science Foundation of China(11172171)

摘要

摘要: 针对PCB（印制电路板）焊点在高低温热循环下的失效，建立了传统结构的三维模型和在芯片边角下加锡块的改进设计模型，通过实验测得FR-4的弹性模量和热膨胀系数，用ANSYS计算了PCB在高低温循环下的应力应变，并用修正的Coffin-Manson经验方程计算了焊点的热循环寿命。结果表明，通过在芯片边角下加锡块，PCB焊点的最大等效塑性应变显著降低，其热疲劳寿命得到明显提高.
- PCB /
- 热循环 /
- 有限元模拟 /
- 疲劳寿命
Abstract: To investigate the fatigue failure of PCB solder joints under thermal impact cycles, a 3D finite element model of PCB with the traditional structure was built. For comparison, an improved structural model with solder pads added at the QFN corners was also built. Based on the measurement of Young’s moduli and thermal expansion coefficients of FR4 by experiment, the thermomechanical FE analysis was conducted on the 2 models in ANSYS. The thermal fatigue life of the PCB solder joints was evaluated by means of the modified CoffinManson equation according to the FEA results. It is found that the peak equivalent plastic strain at the PCB solder joints is significantly reduced after addition of the solder pads at the QFN corners, and the thermal fatigue life of the PCB solder joints was thus greatly improved.
- PCB /
- thermal cycle /
- finite element analysis /
- fatigue life

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参考文献(15)

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PCB焊点热循环失效分析和改进设计

doi: 10.3879/j.issn.1000-0887.2015.04.009

作者简介:
苏佩琳（1991—），女，湖北荆门人，硕士生(E-mail: su7259@163.com);彭雄奇（1970—），男，湖南娄底人，教授，博士生导师(通讯作者. E-mail: xqpeng@sjtu.edu.cn).

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Fatigue Failure Analysis and Structural Improvement of PCB Solder Joints Under Thermal Cycles

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留言板

PCB焊点热循环失效分析和改进设计

doi: 10.3879/j.issn.1000-0887.2015.04.009

作者简介: 苏佩琳（1991—），女，湖北荆门人，硕士生(E-mail: su7259@163.com);彭雄奇（1970—），男，湖南娄底人，教授，博士生导师(通讯作者. E-mail: xqpeng@sjtu.edu.cn).

计量

出版历程

Fatigue Failure Analysis and Structural Improvement of PCB Solder Joints Under Thermal Cycles

计量

出版历程

目录

作者简介:
苏佩琳（1991—），女，湖北荆门人，硕士生(E-mail: su7259@163.com);彭雄奇（1970—），男，湖南娄底人，教授，博士生导师(通讯作者. E-mail: xqpeng@sjtu.edu.cn).