Dynamic Stress Intensity Factor Analysis of Adhesively Bonded Material Interface With Damage Under Shear Loading

CAI Yan-hong; CHEN Hao-ran; TANG Li-qiang; YAN Cheng; JIANG Wan

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Article Navigation > Applied Mathematics and Mechanics > 2008 > 29(11): 1376-1386

CAI Yan-hong, CHEN Hao-ran, TANG Li-qiang, YAN Cheng, JIANG Wan. Dynamic Stress Intensity Factor Analysis of Adhesively Bonded Material Interface With Damage Under Shear Loading[J]. Applied Mathematics and Mechanics, 2008, 29(11): 1376-1386.

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Dynamic Stress Intensity Factor Analysis of Adhesively Bonded Material Interface With Damage Under Shear Loading

1.
State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian, Liaoning 116024, P. R. China;

Received Date: 2007-08-17
Rev Recd Date: 2008-09-26
Publish Date: 2008-11-15

Abstract

Abstract

The dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading is investigated. The material damage was considered. By introducing dislocation density function and using integral transform, the problem was reduced to algebraic equations and could be solved with collocation dots method in the Laplace domain. Finally, the time response of DSIF was calculated with the inverse Laplace integral transform. The conclusions show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, but decreases with swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is 0.5 and independent of the material parameters and damage conditions of materials and time. The oscillatory index is controlled by viscoelastic material parameters.
- dynamic stress intensity factor,
- interface crack,
- adhesively bonded material,
- damage,
- singular integral equation

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References(20)

References

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