Analytical Solutions of Thermal Stress Distribution in Plastic Encapsulated Integrated Circuit Packages

LIU Yu-lan; WANG Biao; WANG Dian-fu

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Article Navigation > Applied Mathematics and Mechanics > 2003 > 24(2): 138-145

LIU Yu-lan, WANG Biao, WANG Dian-fu. Analytical Solutions of Thermal Stress Distribution in Plastic Encapsulated Integrated Circuit Packages[J]. Applied Mathematics and Mechanics, 2003, 24(2): 138-145.

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Analytical Solutions of Thermal Stress Distribution in Plastic Encapsulated Integrated Circuit Packages

Research Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, P. R. China

Received Date: 2001-08-20
Rev Recd Date: 2002-06-04
Publish Date: 2003-02-15

Abstract

Abstract

Due to the mismatch in the coefficients of thermal expansion of slicon chip and the surrounding plastic encapsulation materials, the induced thermal stress is the main cause for die and encapsulant rupture. The corner geometry is simplified as the semi-infinite wedge. Then the two-dimensional thermal stress distribution around the corner was obtained explicitly. Based on the stress calculation, the strain energy density factor criterion is used to evaluate the strength of the structure, which can not only give the critical condition for the stresses, but also determine the direction of fracture initiation around the corner.
- elcetronic package structure,
- thermal stress,
- analytical solution

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References(15)

References

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