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双模量复合材料正交迭层矩形厚板的热弯曲问题

白宗方 王迪新

白宗方, 王迪新. 双模量复合材料正交迭层矩形厚板的热弯曲问题[J]. 应用数学和力学, 1986, 7(8): 739-745.
引用本文: 白宗方, 王迪新. 双模量复合材料正交迭层矩形厚板的热弯曲问题[J]. 应用数学和力学, 1986, 7(8): 739-745.
Bai Zung-fang, Wang Di-xin. Thermal Bending of Thick Rectangular Plates of Bimodulus Composite Materials[J]. Applied Mathematics and Mechanics, 1986, 7(8): 739-745.
Citation: Bai Zung-fang, Wang Di-xin. Thermal Bending of Thick Rectangular Plates of Bimodulus Composite Materials[J]. Applied Mathematics and Mechanics, 1986, 7(8): 739-745.

双模量复合材料正交迭层矩形厚板的热弯曲问题

Thermal Bending of Thick Rectangular Plates of Bimodulus Composite Materials

  • 摘要: 本文给出了双模量复合材料迭层板热弯曲的加权残数解。各层都假定为弹性和热弹性的双模量各向异性材料。该模型是建立在Whitney-Pagano迭层板理论和热弹性模型基础上,考虑了沿板厚的剪切应变。所得挠度和中性面位置的结果和精确解非常吻合。
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    [6] Ambartsumyan, S, A,The equations of temperature stresses of different-modulus materials, Mechanics of Solids, 3 (1968), 58-69.
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    [9] Kamiya, N.,Bimodulus thermoelasticity considering temperature-dependent material properties, in C, W.Bert (ed.),Mechanics of Bimodulus Materials(1979), 29-37.ASME Winter Annual Meeting, 2nd-7th Dec, (1979),New York (ASME, New York).
    [10] Reddy, J, N.,C, W.Bert, Y, S, Hsu and V, S, Reddy, Thermal bending of thick rectangular plates of bimodulus composite materials, Journal Mechanical Engineering Science, 6 (1980),297-304.
    [11] 王迪新、范业立、董万林、周履,双模量复合材料正交迭层矩形薄板的弯曲问题,复合材料学报,2, 1 (1985), 23-37.
    [12] 董万林、范业立、王迪新,双模量复合材料迭层矩形厚板的弯曲,咤第三届全国复合材料学术会议论文集J,第五册(1984), 393-400.
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出版历程
  • 收稿日期:  1985-10-03
  • 刊出日期:  1986-08-15

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