柔性电子器件元件阵列的热脉冲响应分析

卞纯燕; 杨文成; 缪馥星

doi:10.21656/1000-0887.460035

柔性电子器件元件阵列的热脉冲响应分析

doi: 10.21656/1000-0887.460035

宁波大学冲击与安全工程教育部重点实验室，浙江宁波 315211

基金项目:

国家自然科学基金(11572161

11872218)；浙江省自然科学基金重点项目（LZ23A020001）

详细信息

作者简介:
卞纯燕（1997—），女，硕士生(E-mail: 2211090002@nbu.edu.cn);缪馥星（1980—），女，教授(通讯作者. E-mail: miaofuxing@nbu.edu.cn).

通讯作者:
缪馥星（1980—），女，教授(通讯作者. E-mail: miaofuxing@nbu.edu.cn).

中图分类号: O347.1
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- 文章访问数: 46
- HTML全文浏览量: 10
- PDF下载量: 9
- 被引次数: 0
出版历程
- 收稿日期: 2025-02-27
- 修回日期: 2025-04-14
- 网络出版日期: 2025-05-30

Thermal Impulse Response Analysis of Element Arrays in Flexible Electronic Devices

MOE Key Laboratory of Impact and Safety Engineering, Ningbo University,Ningbo, Zhejiang 315211, P.R.China

Funds:

The National Science Foundation of China(11572161

11872218)

摘要

摘要: 柔性电子器件在工作时产生的热量，导致元件发生变形，极易影响其功能性.本研究建立了柔性电子器件元件阵列热脉冲响应的有限元分析模型，探讨了柔性电子器件元件封装层与基底层的层厚比对整体结构热稳定性的影响，以及柔性电子器件元件的热脉冲响应.初步得到：当热脉冲载荷从50 W/m²增大至150 W/m²时，功能层中心单元温度上升约0.47%，热应力增大约25.87%；若封装层与基底层的层厚比从0.2增大到5.0，功能层中心单元的热应力降低约92%，热应变降低约99%，沿层厚方向的位移降低约86%.初步结果可为柔性电子器件元件热脉冲载荷的优化设计和防护提供基础数据.
- 柔性电子器件元件阵列 /
- 热脉冲响应 /
- 温度场 /
- 热应力 /
- 有限元分析
Abstract: The heat generated by flexible electronic devices during operation leads to deformation of the components, which is highly likely to affect their functionality. A finite element analysis model for the thermal impulse responses of the flexible electronic device element arrays were established, and the effects of the layer thickness ratio of the encapsulation layer to the substrate layer of the flexible electronic device element on the thermal stability of the overall structure, as well as the thermal impulse responses of the flexible electronic device components, were investigated. The results show that, the temperature of the functional layer center element rises by about 0.47% and the thermal stress increases by about 25.87% with the thermal impulse load increasing from 50 W/m² to 150 W/m². With the layer thickness ratio of the encapsulation layer to the substrate layer increasing from 0.2 to 5.0, the thermal stress of the functional layer center unit decreases by about 92%, the thermal strain decreases by about 99%, and the displacement along the layer thickness decreases by about 86%. The work provides basic data for the optimization design and protection against thermal impulse loading on flexible electronic device components.
- flexible electronic device element array /
- thermal impulse response /
- temperature field /
- thermal stress /
- finite element analysis

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参考文献(30)

李学通, 仝洪月, 赵越, 等. 柔性电子器件的应用、结构、力学及展望[J]. 力学与实践, 2015,37(3): 295-301.

(LI Xuetong, TONG Hongyue, ZHAO Yue, et al. Structures, mechanical properties and applications of flexible electronic components[J].Mechanics in Engineering,2015,37(3): 295-301. (in Chinese))

[2]蔡依晨, 黄维, 董晓臣. 可穿戴式柔性电子应变传感器[J]. 科学通报, 2017,62(7): 635-649. (CAI Yichen, HUANG Wei, DONG Xiaochen. Wearable and flexible electronic strain sensor[J].Chinese Science Bulletin,2017,62(7): 635-649. (in Chinese))

[3]KHANG D Y, JIANG H, HUANG Y, et al. A stretchable form of single-crystal silicon for high-performance electronics on rubber substrates[J].Science,2006,311(5758): 208-212.

[4]许巍, 卢天健. 柔性电子系统及其力学性能[J]. 力学进展, 2008,38(2): 137-150.(XU Wei, LU Tianjian. Flexible electronics system and their mechanical properties[J].Advances in Mechanics,2008,38(2): 137-150. (in Chinese))

[5]KO H C, STOYKOVICH M P, SONG J, et al. A hemispherical electronic eye camera based on compressible silicon optoelectronics[J].Nature,2008,454(7205): 748-753.

[6]Lü C F, LI M, XIAO J L, et al. Mechanics of tunable hemispherical electronic eye camera systems that combine rigid device elements with soft elastomers[J].Journal of Applied Mechanics,2013,80(6): 061022.

[7]TRUNG T Q, LEE N E. Recent progress on stretchable electronic devices with intrinsically stretchable components[J].Advanced Materials,2017,29(3): 1603167.

[8]ZHOU J C, GUO X H, XU Z S, et al. Highly sensitive and stretchable strain sensors based on serpentine-shaped composite films for flexible electronic skin applications[J].Composites Science and Technology,2020,197: 108215.

[9]KIM H S, BRUECKNER E, SONG J Z, et al. Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting[J].Proceedings of the National Academy of Sciences of the United States of America,2011,108(25): 10072-10077.

[10]DE LIMA JR M M , LACERDA R G, VILCARROMERO J, et al. Coefficient of thermal expansion and elastic modulus of thin films[J].Journal of Applied Physics,1999,86(9): 4936-4942.

[11]GLESKOVA H, CHENG I C, WAGNER S, et al. Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits[J].Applied Physics Letters,2006,88(1): 011905.

[12]TORUN H, UREY H. Thermal deflections in multilayer microstructures and athermalization[J].Journal of Applied Physics,2006,100(2): 023527.

[13]牛利刚, 杨道国, 李功科. 晶圆尺寸级封装器件的热应力及翘曲变形[J]. 电子元件与材料, 2009,28(11): 48-51.(NIU Ligang, YANG Daoguo, LI Gongke. Research on the thermal stress and warpage of WLCSP device[J].Electronic Components and Materials,2009,28(11): 48-51. (in Chinese))

[14]HUANG Y A, YIN Z P, XIONG Y L. Thermomechanical analysis of film-on-substrate system with temperature-dependent properties[J].Journal of Applied Mechanics,2010,77(4): 041016.

[15]ZHANG J P, LI Y H, XING Y F, et al. Three-dimensional thermomechanical analysis of epidermal electronic devices on human skin[J].International Journal of Solids and Structures,2019,167: 48-57.

[16]SHI Y Y, XU J Q, LI Y, et al. Theoretical model of thermal stress in the film-substrate system of optical thin film[J].Journal of Electronic Materials,2022,51(10): 5937-5945.

[17]GAO J, XU Z P, HAN R Y, et al. Refinement of hyperelastic models based on tension and compression experiments of polydimethylsiloxane (PDMS)[J].Mechanics of Solids,2024,59(2): 955-965.

[18]MAZURKIEWICZ D. Problems of numerical simulation of stress and strain in the area of the adhesive-bonded joint of a conveyor belt[J].Archives of Civil and Mechanical Engineering,2009,9(2): 75-91.

[19]HUMOOD M, SHI Y, HAN M D, et al. Fabrication and deformation of 3D multilayered kirigami microstructures[J].Small,2018,14(11): e1703852.

[20]JOHNSTON I D, MCCLUSKEY D K, TAN C K L, et al. Mechanical characterization of bulk Sylgard 184 for microfluidics and microengineering[J].Journal of Micromechanics and Microengineering,2014,24(3): 035017.

[21]吴林志, 殷莎, 马力. 复合材料点阵夹芯结构的耦合换热及热应力分析[J]. 功能材料, 2010,41(6): 969-972. (WU Linzhi, YIN Sha, MA Li. Coupled heat transfer and thermal stress analysis of composite lattice core sandwich structure[J].Journal of Functional Materials,2010,41(6): 969-972. (in Chinese))

[22]梁艳苹, 苏小卒. 有力筋块体自由摇摆振动恢复系数有限元分析[J]. 土木工程, 2018,7(5): 725-733.（ LIANG Yanping, SU Xiaochu. FEM analysis of restitution coefficient of free rocking block with tendon[J].Hans Journal of Civil Engineering,2018,7(5): 725-733. (in Chinese))

[23]GUVEN I, MADENCI E. Transient heat conduction analysis in a piecewise homogeneous domain by a coupled boundary and finite element method[J].International Journal for Numerical Methods in Engineering,2003,56(3): 351-380.

[24]YIN Y F, LI Y H, LI M. Thermal analysis of the flexible electronics affixed on large curvature myocardium surface[J].International Journal of Heat and Mass Transfer,2020,147: 118983.

[25]XU K C, LU Y Y, YAMAGUCHI T, et al. Highly precise multifunctional thermal management-based flexible sensing sheets[J].ACS Nano,2019,13(12): 14348-14356.

[26]苏梅英, 陆原, 万里兮, 等. 基于三维多芯片柔性封装的热应力分析[J]. 现代电子技术, 2015,38(3): 141-143.(SU Meiying, LU Yuan, WAN Lixi, et al. Analysis of thermal stress for 3-D multichip flexible encapsulation[J].Modern Electronics Technique,2015,38(3): 141-143. (in Chinese))

[27]TRIPATHY K, BHATTACHARJEE M. Stretching mode deformation analysis for an elastomeric encapsulation-assisted stable flexible electronic substrate[J].Flexible and Printed Electronics,2023,8(2): 025002.

[28]YANG Y Q, WINKLER A, KARIMZADEH A. A practical approach for determination of thermal stress and temperature-dependent material properties in multilayered thin films[J].ACS Applied Materials & Interfaces,2024,16(24): 31729-31737.

[29]HUANG J, ZHANG Y, FAN A, et al. Remarkable thermal conductivity reduction of silicon nanowires during the bending process[J].ACS Applied Materials & Interfaces,2023,15(33): 39689-39696.

[30]CUI Y, LI Y H, XING Y F, et al. One-dimensional thermal analysis of the flexible electronic devices integrated with human skin[J].Micromachines,2016,7(11): 210.

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柔性电子器件元件阵列的热脉冲响应分析

doi: 10.21656/1000-0887.460035

作者简介:
卞纯燕（1997—），女，硕士生(E-mail: 2211090002@nbu.edu.cn);缪馥星（1980—），女，教授(通讯作者. E-mail: miaofuxing@nbu.edu.cn).

通讯作者:
缪馥星（1980—），女，教授(通讯作者. E-mail: miaofuxing@nbu.edu.cn).

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Thermal Impulse Response Analysis of Element Arrays in Flexible Electronic Devices

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留言板

柔性电子器件元件阵列的热脉冲响应分析

doi: 10.21656/1000-0887.460035

作者简介: 卞纯燕（1997—），女，硕士生(E-mail: 2211090002@nbu.edu.cn);缪馥星（1980—），女，教授(通讯作者. E-mail: miaofuxing@nbu.edu.cn).

通讯作者: 缪馥星（1980—），女，教授(通讯作者. E-mail: miaofuxing@nbu.edu.cn).

计量

出版历程

Thermal Impulse Response Analysis of Element Arrays in Flexible Electronic Devices

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出版历程

目录

作者简介:
卞纯燕（1997—），女，硕士生(E-mail: 2211090002@nbu.edu.cn);缪馥星（1980—），女，教授(通讯作者. E-mail: miaofuxing@nbu.edu.cn).

通讯作者:
缪馥星（1980—），女，教授(通讯作者. E-mail: miaofuxing@nbu.edu.cn).